The exclusive SHIP Other Transaction Agreement (OTA), worth up to $75 million, was awarded to Qorvo by the Naval Surface Warfare Center (NSWC), Crane Division. defense contractors and commercial clients that require design, validation, assembly, test and manufacturing of next-generation RF components. The SHIP program will ensure that microelectronics packaging expertise and leadership is available for both U.S. government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center. Qorvo® to Create State-of-the-Art Semiconductor Packaging Center
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